Our Capabilities Comprehensive
Our Manufacturing Capabilities include:

Surface Mount Lines (SMT)
      Stencil Printing
      Jet Printing
      Package on Package
      Advanced Packages
      Convection Reflow
      Vapor Phase Soldering
Selective Thru Hole Soldering
J-STD-001 Manual / Hand Soldering
Conformal Coating
Functional Testing
Flying Probe
Thermal Chamber (ESS)
Wire/Cable Assembly
Box Build
Wire bonding
Die Attach
Silver Sintering
Plasma Cleaning
Advanced package assembly including Fine pitch, COB (Chip-on-board), COF (Chip on Flex), BGA, QFN, LGA, DFN, CSP, uBGA, Flip Chip, PoP (Package on Package), and others
Custom rework, repair, and modification
Mechanical Assembly
Clean Room Assembly
Machining and Fabrication
3D Printing
Specialty Rework and Repair
X-Ray Analysis
Multiple Soldering Alloys, Fluxes, and Materials Supported
Product serialization and material traceability
IPC Class 2,3 (and above) workmanship levels

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